Prior to the widespread adoption of Carrier Ethernet, businesses seeking increased bandwidth from T1 lines faced two primary options: upgrading to T3/DS3 for a substantial leap in capacity, or incrementally combining multiple T1 lines through bonding. However, the emergence of Ethernet over Copper (EoC) presents a compelling alternative for dedicated bandwidth.
T1 lines gained popularity due to their accessibility and sufficient bandwidth for smaller businesses or specialized applications within larger organizations. These lines provide 1.5 Mbps for both uploads and downloads.
Within the T-Carrier family, T3 service delivers a significantly higher bandwidth of 45 Mbps in both directions. While initially transmitted via microwave, coaxial cable, or waveguide, T3 is now commonly delivered as DS3 over SONET fiber optic networks. Utilizing the OC-3 standard, SONET can carry three multiplexed DS3 services simultaneously. At the customer’s demarcation point, DS3 is extracted and delivered via a standard interface consisting of two small coaxial copper cables with BNC connectors.
This method proves effective for many businesses, particularly in metropolitan areas with readily available metro fiber. DS3 offers a fast and reliable solution for those requiring 45 Mbps and possessing the budget for it. However, challenges arise for businesses with lower bandwidth needs, limited budgets, and constrained by the limitations of 1.5 Mbps T1 lines.
Two traditional solutions address this situation. One approach involves gradually scaling up from T1 service, while the other utilizes fractional DS3, a service that provides reduced bandwidth at a lower cost by throttling back a full DS3 connection.
Scaling up from T1 involves bonding multiple lines to combine their bandwidth. For instance, two bonded T1 lines deliver 3 Mbps, and additional lines can be added incrementally to reach a practical limit of around 10-12 Mbps. This method offers the benefit of gradual bandwidth and cost adjustments, aligning with the growth patterns of many businesses. Furthermore, T1 lines utilize existing twisted pair telco wiring commonly used for multi-line telephone systems. Adding T1 lines often involves utilizing vacant pairs within the existing wire bundle connecting the business to the telco central office.
This aspect proves advantageous by eliminating the high costs associated with installing new fiber optic infrastructure. In the absence of available DS3, businesses might face limited copper-based options or significant construction expenses. Even when DS3 is available, fractional DS3 may not yield proportional cost savings compared to a full DS3 connection.
Fortunately, a favorable solution exists in the form of Ethernet over Copper (EoC). Similar to T1, EoC utilizes existing twisted pair telco wiring. Like fractional DS3, it offers bandwidth capacities exceeding T1 but with a highly competitive per-Mbps pricing structure.
Smaller businesses often favor 2x2 Mbps and 3x3 Mbps EoC services, providing symmetrical upload and download speeds. Notably, 2 or 3 Mbps EoC can often be obtained at a price point comparable to a 1.5 Mbps T1 line, with actual costs varying based on local competition. This presents a compelling opportunity for increased bandwidth at no additional cost.
Ethernet over Copper offers further flexibility with readily available bandwidth options ranging from 5 Mbps to 45 Mbps, all delivered over existing copper infrastructure. While pricing varies, EoC generally surpasses T1 and DS3 in affordability, often costing half the monthly price. However, distance limitations restrict EoC availability beyond a mile or two from the central office. Nonetheless, this limitation still encompasses a significant portion of business locations nationwide.
Businesses grappling with limited bandwidth options or the cost barriers associated with T1 and DS3 are encouraged to explore Ethernet over Copper pricing and availability. The results might reveal significant bandwidth advantages for their investment.